Production Overview
DIP（Dual-In-line packages） have been an industry standard for a long time. The applications are common in consumer products, automotive devices, memory, analog ICs, and microcontrollers. These packages have evolved into a state-of-the-art technology owing to their robust reliability and great improvement on performance. Using TH ( through hole) and assembly, DIP provide an assortment of packaging capabilities, especially in low pin count devices at competitive manufacturing costs.
Key Features
|
PKG TYPE |
DIP300mil |
DIP400mil |
DIP600mil |
DIP750mil |
|
Lead Count |
8~24 |
28/32 |
24/28/42/48/52 |
64/88 |
|
LF Material |
Cu |
Cu |
Cu |
Cu |
|
Body Width
(mm) * (mm) |
7.62 |
10.16 |
15.24 |
19.05/19.50 |
|
Body Thickness |
3.30 |
3.30/3.80 |
3.81 |
3.80 |
|
Lead pitch (mm) |
2.54/1.778 |
1.778 |
2.54/1.778 |
1.778/1.27 |
(1mm=39.37mil; 1mil=25.4um)
* The width of DIP is the distance of shoulder-to-shoulder.
Reliability Test Standards
The test criterion is zero defect out of 77 sampling units.
|
Temp/Humidity Test |
85°C/ 85% RH, JEDEC 22- A101 |
|
Pressure Cooker Test |
121°C/ 100% RH/ 15 PSIG, JEDEC 22- A102 |
|
Temp Cycle Test |
-65 ~ 150°C, JEDEC22-A104 |
|
High Temp Storage Test |
150°C, JEDEC 22- A103 |
|
High Accelerated Stress Test |
130°C/ 85% RH/ 33.5 PSIA, JEDEC 22- A110/A118 |
|