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Technology Advantage
Public Unit:通富微电  |  Public Date:11/26/2008 6:40:17 PM  |  Hits:35651

 MCM(MCP) multi-chip module package (multi-chip package)

 Pb-free assembly solutions including pure Sn, SnBi, NiPdAu

 MEMS acceleration sensor package

 Leadless Quad Flat package

 Ball Grid Array package

 12 inch wafer assembly and test

 Strip-test technology

 Automotive Electronic IC Assembly & Test

 Cooper Wire Bonding applied to IC package

 Multi leads LQFP package such as LQFP179/208/216/256

 

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